Rheological behaviour of bentonite film between grains of molding sand were tested with a self-designed apparatus. 用一台自己设计的仪器对型砂砂粒间粘土膜进行了测试。
Application of Gas-Assisted Injection Molding Technology in Injection Mold for the Cover of Apparatus Using in Medical 气辅注射技术在医疗分析仪器罩注射模设计中的应用
Test result shows that the control error of molding sand compactability of this apparatus retains in the range of ± 2.6%. 试验结果表明,该装置的型砂紧实率控制误差保持在±2.6%以内。
Development of medical microcapsule-molding apparatus 医用微胶囊成型装置的研制
Epoxy Molding Compound ( EMC) is a kind of electronic material applied in the package of semiconductor apparatus and IC chip. 环氧塑封料(EpoxyMoldingCompound)是一种半导体封装用电子材料,主要应用于半导体器件和集成电路芯片的封装。